What makes copper oxide

Figure 2 shows the stages in the synthesis to obtain Cu oxide films. A nontoxic permanent marker typically engaged in the design of PCBs was used to synthesize Cu oxide samples. Iron chloride FeCl 3 solution activated with H 2 O was employed as the electrolyte.

The reaction mechanism for Cu corrosion can be written in two stages as. In accordance with the following reaction mechanism, the formation of Cu oxide films took place in two stages: where is the chemical composition in Cu oxide samples. The surface of Cu oxide samples resulted with opaque gray color after thermal process. Nevertheless, as the activity of these species is poorer under heating process within humidity, the Cu oxide films were nonstoichiometric.

Conduction behavior in the samples was registered and evaluated by current-voltage curves at room temperature. The electrical parameters of the samples were collected by employing a digital storage oscilloscope Tektronix, TDSC. To know the performance of the Cu oxide samples as a function of structure defects involved, a stability analysis was done by a correlation profile between elastic strain and Cu oxide percentage.

This section discusses phase formation and conduction properties in the Cu oxide samples. Here are the revised XRD patterns and electrical characterization to demonstrate the potential of the selective corrosion technique with emphasis in the oxidation degree of the Cu foils dependent on their plastic deformation. Figure 3 shows XRD patterns of Cu oxide films synthesized with the heating process. Also, peak positioned at As a reference, the XRD pattern of Cu foil also is shown.

The larger peak-position displacement between XRD patterns of the Cu oxide films and XRD pattern of the Cu foil was observed which ensures presence of the elastic strain in Cu oxide surface induced by high density of the defects in chemically attacked Cu foils. The performance of Cu oxide samples has been confirmed with the schematic diagram of Figure 4 a.

The log current-voltage plots for samples labeled as CS-1, CS-2, and CS-3 are shown in Figure 4 b , where such current-voltage curves have shown ohmic behavior.

The rate was extracted from Figure 4 b , with as the differential voltage and as the differential current, respectively, while was estimated with the slope of the dotted line in Figure 4 b which crosses at the voltage axis. Using MATLAB program, the cross-sectional area is computed by solving 5 and by the Arrhenius conductivity dependent on temperature [ 17 ].

Table 2 summarizes the conduction parameters found. To evaluate the performance of the Cu oxide samples as a function of the plastic deformation in Cu foils, average strain along each crystallographic plane on the oxidized Cu surface with respect to the Cu foil as substrate is approximately estimated by [ 12 ], where is the difference between measured incident angle and reference angle , while the angle of each Cu foil plane corresponds to.

The parameter can be linked with the chemical composition in which defines its nonstoichiometry [ 20 ].

The elastic strain must be analyzed as a function of Cu oxide grown, being it proportional to the intensity in percentage of each peak [ 12 , 20 ].

Figure 3 allows evaluating at each crystallographic plane of both oxides Cu 2 O and CuO , as well as at each crystallographic plane in the Cu foil; thus, a correlation profile between and Cu oxide percentage is built in Figure 5.

The structure defects can be validated by stability analysis, which determines the ability of the Cu oxide layers to remain structurally stable during electrical conduction.

The stability in the Cu oxide samples is a function of both tensile and compressive stress into a limit where Cu oxide is fully grown into two phases. As Cu vacancies agglomeration or trapped oxygen happen into grain boundaries, intrinsic concentration of defects corresponding with and the opaque gray color in Cu oxide samples explicate the stability of the CuO phase.

Cu oxide samples synthesized by corrosion and heating processes at low temperature have been studied. Selective corrosion was achieved by chemical attack in smaller areas from Cu foils of commercial PCBs. Both CuO and Cu 2 O phases were formed under air atmosphere. The study conducted by X-ray diffraction and electrical characterization found that phase formation and conduction properties are linked with structure defects into Cu foils.

Stability analysis has confirmed that the structure behavior in Cu oxide samples is strongly dependent on its intrinsic disorder.

Thus, the selective corrosion technique has significant benefits as physical and mechanical properties are influenced by plastic deformation, which has resulted in stable Cu oxide samples with next electronic engineering applications for Cu oxide-based devices. The author declares that there are no conflicts of interest, but there is an interest regarding the publication of this manuscript to share knowledge about green material processing and their applications.

The structural data collected from XRD studies have been supported thanks to Dr. This is an open access article distributed under the Creative Commons Attribution License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Article of the Year Award: Outstanding research contributions of , as selected by our Chief Editors. Read the winning articles. Journal overview. Special Issues. Academic Editor: Alicia E. What is special about copper, and how will it take us to the next level in healthcare safety? A reddish-orange metal, copper is highly conductive to heat and electricity. It shares this ability with silver and gold, as these elements each have an "free agent" electron that is open to negotiations for chemical bonds with any surrounding available atom.

All the other electrons are firmly contracted to stay with their team, but this one can be easily influenced to transfer. The metallic bond of a copper wire, for example, creates a crystalline form with a sea of electrons that are in a state of attraction to all surrounding nuclei, existing in a stable, shared state. As a result of these valence electrons, when electricity or heat is introduced to the wire, these free electrons move through the material, creating a current.

Right underneath the free agent electron level is a level jam-packed with electrons - no more can fit on this level. This means that transferring electrons from this level is very difficult.

As a result, copper's metallic bonds only exist on this outer layer of free-moving electrons, a pretty weak bond as far as metals are concerned.

This is why copper is so soft and easy to bend and cut. This same free agent electron plays a role in oxidation , or rusting. When copper is exposed to water molecules two hydrogen, one oxygen , this free electron is transferred to a neighboring oxygen atom, bonding it into a molecule.

If only one atom of copper bonds to an oxygen molecule, it is called cupric oxide. If two copper atoms bond to an oxygen atom, it is cuprous oxide. Cupric oxide is considered "fully oxidized," while cuprous oxide is still in an active state.

The key to cuprous oxide, the aspect that makes is extremely effective as a biocide, is that active state. The nanometer grade copper oxide powders are modified with small particle size and concentration. Problems such as discoloration, rapid migration, and notching of other antimicrobial powders are thus solved. It has a strong antibacterial effect on all kinds of pathogenic bacteria such as Escherichia Coli, Staphylococcus aureus, Candida albicans and so on.

It has a broad spectrum of sterilization and does not produce drug resistance, no toxic reaction, no skin bites. It is widely used in polyester, polypropylene, nylon and other chemical fiber fields.

Academically, research has been carried out on the antimicrobial activity of copper oxide nanoparticles CuO such as that carried out at the Peruvian Institute of Nuclear Energy in conjunction with the National Engineering University of Peru. These studies are carried out to propose antimicrobial surfaces that could be used in Hospitals and clinics.

Based on the antimicrobial activity of copper oxides, research continues, even sheets with copper oxide particles mixed with cloth fibers can be found so that the mites do not survive in these products.

Taking advantage of industrial applications and looking for more innovations, scientific and industrial research continues to be carried out to optimize the use of these compounds. The intake of this compound in any of the two forms of copper oxide is toxic. If inhaled, copper I oxide can cause damage to the respiratory tract, breathing complications, and cough.

If it is ingested, it can give rise to irritation of the gastrointestinal tract, stomach pain, diarrhea, and vomiting. Copper II oxide has also the same symptoms if ingested, in addition to skin discoloration and vision problems. Both composites can give rise to "metal fume fever", a state that causes flu-like symptoms and is a risk that exists in the heating of copper or wire structures. To conclude, Copper is a reddish, soft, ductile and malleable metal.

It is the industrial metal with the best conductive capacity of electricity. When combined with oxygen, it forms copper oxide I or copper oxide II. Both compounds have varied industrial applications.

Copper oxide nanoparticles are currently of great importance due to their various applications such as antimicrobial eliminates bacteria and fungi , photocatalyst degrades dyes , and components of electrical systems magnetic stores and gas sensors.

Copper and Oxygen, when combined, form very interesting materials, including copper oxide I and copper oxide ll , both minerals are found in nature and have special characteristics and particular uses. The copper oxide II , also known as cupric oxide exists in nature as a component of minerals as tenorite and paramelaconite and extracted minerals around the world, however, there is a process to produce industrially.

Copper Oxide is insoluble in water and soluble in ammonia solution. It is a compound that when dissolved in hydrochloric acid, HCuCl 2 is obtained. It has a plethora of applications due to its remarkable characteristics.